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Company News & Insights

AttoTude Secures $50M Series B Funding to Accelerate Deployment of Revolutionary THz Interconnect Technology

AttoTude, the pioneer of groundbreaking THz interconnect technology for AI and hyperscale data center applications, today announced it has raised $50 million in Series B funding led by Mayfield and joined by The Westly Group, with participation from existing investors Sutter Hill Ventures, Canaan Partners, and Wing Venture Capital. This latest investment brings AttoTude's total funding to $91 million, following its $30 million Series A in 2024 and $11 million Seed round earlier that year.

Company News & Insights

Why AttoTude?

Read a letter from Dave Welch, co-founder and CEO of AttoTude, highlighting the growing energy demands of AI-driven data centers. With decades of experience in telecommunications, he notes that machine-to-machine communication now dominates bandwidth usage. AttoTude aims to revolutionize interconnect technology to significantly reduce energy consumption while improving scalability, bandwidth, and reliability.

Events Calendar

Join Us at OFC50

The OFC Technical Conference is a five-day event featuring peer-reviewed presentations, over 120 invited speakers, and various technical sessions, including symposia, special sessions, workshops, and short courses. Attendees can also explore live demonstrations in the Demo Zone, engage with emerging technologies via OFCnet, and participate in networking and industry-focused programs on the show floor.

Events Calendar

AttoTude Introduces $29M in Series A to Revolutionize High-Speed Networking for AI and Hyperscale Data Center Applications

AttoTude, a leader in interconnect technology for AI and hyperscale data centers, has secured $29M in Series A funding, following an $11M Seed Round earlier in 2024. Investors include Sutter Hill Ventures, Canaan Partners, and Wing Venture Capital. The company is developing high-speed interconnect solutions with speeds up to 448 Gb/s, offering superior performance, efficiency, and scalability using existing manufacturing processes.